History log of /rkbin/doc/release/RV1106_CN.md (Results 26 – 50 of 58)
Revision Date Author Comments
# 2c88cc70 04-Jul-2023 Ziyuan Xu <xzy.xu@rock-chips.com>

rv1106: mcu: update hpmcu tb bin to v1.68

build from commit:
rtt:097fece7#hal:d93ef9fd#battery_ipc:21165ac

build from rt-thread commit in develop branch:
097fece77d bsp: rockchip: rv1106-mc

rv1106: mcu: update hpmcu tb bin to v1.68

build from commit:
rtt:097fece7#hal:d93ef9fd#battery_ipc:21165ac

build from rt-thread commit in develop branch:
097fece77d bsp: rockchip: rv1106-mcu: board: use pstore-mcu-log as console_output

build from hal commit in master branch:
d93ef9fd: device: rk3568: touch gic everytime in IRQ_HardIrqPreemptHandler

build from battery-ipc commit in master branch:
21165ac fix print log condition

Signed-off-by: Ziyuan Xu <xzy.xu@rock-chips.com>
Change-Id: Ifa3da1c8d2468a6905ab416d8a25937385ff9021

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# 431b8663 10-Jul-2023 Wesley Yao <wesley.yao@rock-chips.com>

rv1106: ddr: Update DDR bin to v1.13 20230710

Build from:
37a6671fc7 dram_init: rv1106: Update to v1.13

Update feature:
be7129d2d5 drivers: ram: rv1106: Support resume

Signed-off-by: Wesley Yao

rv1106: ddr: Update DDR bin to v1.13 20230710

Build from:
37a6671fc7 dram_init: rv1106: Update to v1.13

Update feature:
be7129d2d5 drivers: ram: rv1106: Support resume

Signed-off-by: Wesley Yao <wesley.yao@rock-chips.com>
Change-Id: Ib26434a5149e9a992d80203b5d9350a9835c2875

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# 573e6932 04-Jul-2023 Wang Xiaobin <xb.wang@rock-chips.com>

rv1106: mcu: update gc2093 hpmcu tb bin to v1.66

build from commit:
rtt:f047d6a191#hal:d93ef9fd#battery_ipc:68c599d

build from rt-thread commit in develop branch:
f047d6a1: [Tools]: add bat

rv1106: mcu: update gc2093 hpmcu tb bin to v1.66

build from commit:
rtt:f047d6a191#hal:d93ef9fd#battery_ipc:68c599d

build from rt-thread commit in develop branch:
f047d6a1: [Tools]: add battery-ipc repository version information

build from hal commit in master branch:
d93ef9fd: device: rk3568: touch gic everytime in
IRQ_HardIrqPreemptHandler

build from battery-ipc commit in master branch:
68c599d: fast_ae: fix compile warning

Signed-off-by: Wang Xiaobin <xb.wang@rock-chips.com>
Change-Id: If0b618b867e6eae9118bbbc683d106ae30ac2b48

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# ba6bde9e 25-May-2023 Wang Xiaobin <xb.wang@rock-chips.com>

rv1106: mcu: update gc2093 hpmcu tb bin to v1.65

build from commit:
rtt:d2d09ba#hal:d93ef9fd#battery_ipc:0534d87

build from rt-thread commit in develop branch:
d2d09ba: release RV1106/RV110

rv1106: mcu: update gc2093 hpmcu tb bin to v1.65

build from commit:
rtt:d2d09ba#hal:d93ef9fd#battery_ipc:0534d87

build from rt-thread commit in develop branch:
d2d09ba: release RV1106/RV1103 RT-Thread SDK

build from hal commit in master branch:
d93ef9fd: device: rk3568: touch gic everytime in IRQ_HardIrqPreemptHandler

build from battery-ipc commit in master branch:
0534d87: fastae: sync with aiq v5.0x1.2-rc4

Signed-off-by: Wang Xiaobin <xb.wang@rock-chips.com>
Change-Id: I60844d653c6d6a2cefed4a7affdd8b5bb82e5fef

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# 4d61e7f8 21-Jun-2023 Ziyuan Xu <xzy.xu@rock-chips.com>

rv1106: mcu: update hpmcu tb bin to v1.67

build from commit:
rtt:f047d6a191#hal:d93ef9fd#battery_ipc:68c599d

build from rt-thread commit in develop branch:
f047d6a1: [Tools]: add battery-ip

rv1106: mcu: update hpmcu tb bin to v1.67

build from commit:
rtt:f047d6a191#hal:d93ef9fd#battery_ipc:68c599d

build from rt-thread commit in develop branch:
f047d6a1: [Tools]: add battery-ipc repository version information

build from hal commit in master branch:
d93ef9fd: device: rk3568: touch gic everytime in IRQ_HardIrqPreemptHandler

build from battery-ipc commit in master branch:
68c599d: fast_ae: fix compile warning

Signed-off-by: Ziyuan Xu <xzy.xu@rock-chips.com>
Change-Id: Ib4333e09a9e8cf6a3d3ace1b410bb6d63baa7971

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# 939d1016 07-Jun-2023 Weiwen Chen <cww@rock-chips.com>

rv1106: mcu: update sc4336/sc3336/sc3338/sc230ai/dual_sc3338 hpmcu tb bin to v1.66

build from commit:
rtt:07ac6e9#hal:d93ef9fd#battery_ipc:04a4e08

build from rt-thread commit in develop branch:

rv1106: mcu: update sc4336/sc3336/sc3338/sc230ai/dual_sc3338 hpmcu tb bin to v1.66

build from commit:
rtt:07ac6e9#hal:d93ef9fd#battery_ipc:04a4e08

build from rt-thread commit in develop branch:
07ac6e9: bsp: rockchip: camera: conver reg list to support i2c continuous writing

build from hal commit in master branch:
d93ef9fd: device: rk3568: touch gic everytime in IRQ_HardIrqPreemptHandler

build from battery-ipc commit in master branch:
04a4e08: fastae: sync with aiq v5.0x1.2-rc5

Signed-off-by: Weiwen Chen <cww@rock-chips.com>
Change-Id: I45618153cedff67c7595e6377a68d63c0eb936ef

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# d1a40388 11-May-2023 XiaoDong Huang <derrick.huang@rock-chips.com>

rv1106: tee with ta: add initial version v1.00

Build from optee commit in develop-next branch:
eda5ab67 plat-rockchip: rv1106: support system reset

Update feature:
eda5ab67 plat-rockchip: r

rv1106: tee with ta: add initial version v1.00

Build from optee commit in develop-next branch:
eda5ab67 plat-rockchip: rv1106: support system reset

Update feature:
eda5ab67 plat-rockchip: rv1106: support system reset
005c73e9 plat-rockchip: rv1106: disable dynamic share memory
cb5b2dc5 plat-rockchip: rv1106: support oem key cipher
219e4f0f scripts: commit_bin.sh: add rv1106 platform in show_usage
8ae66992 rv1106: add oem otp key functions
7a4b866d rv1106: enable CFG_RK_OEM_NS_OTP
239b47c1 rv1106: otp: enable CFG_RK_UBOOT_STORE_OTP
89c39ca3 rv1106: otp: enable CFG_OTP_SUPPORT
409eacd1 rv1106: otp: support R&W OTP data
ad7d3b6c plat-rockchip: support rv1106 soc

Change-Id: If1ce3d77f0390c6fccc73a31efac3fdf52037de5
Signed-off-by: XiaoDong Huang <derrick.huang@rock-chips.com>

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# 10d78d1d 31-May-2023 Wesley Yao <wesley.yao@rock-chips.com>

rv1106: ddr: Update DDR bin to v1.12 20230531

Build from:
6cf9a2f250 dram_init: rv1106: Update to v1.12

Update feature:
dd6f7dc7c6 drivers: ram: rv1106: Fast exit (DLL on) for power down on DDR3

rv1106: ddr: Update DDR bin to v1.12 20230531

Build from:
6cf9a2f250 dram_init: rv1106: Update to v1.12

Update feature:
dd6f7dc7c6 drivers: ram: rv1106: Fast exit (DLL on) for power down on DDR3
76b28dbce9 drivers: ram: rv1106: Support modify refresh rate in loader_params
ed9d2f002f drivers: ram: rv1106: Fix calc of cs_pst
5af756bb61 drivers: ram: rv1106: Add print when distinguishing DDR2 from DDR3

Signed-off-by: Wesley Yao <wesley.yao@rock-chips.com>
Change-Id: I87dd6ceb87479c5827c2957fa057e5b4b8afd359

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# ddca0f3a 22-Mar-2023 Chuanhu Sun <aaron.sun@rock-chips.com>

rv1106: rv1106_hpmcu_wrap: update version to v1.56

build from rockit-ko commit in master branch:
d1a2dabb mcu bin: update version to v1.56

build from hal commit in master branch:
a76806e7 p

rv1106: rv1106_hpmcu_wrap: update version to v1.56

build from rockit-ko commit in master branch:
d1a2dabb mcu bin: update version to v1.56

build from hal commit in master branch:
a76806e7 project: common: riscv: change riscv toolchain to xpack

Signed-off-by: Chuanhu Sun <aaron.sun@rock-chips.com>
Change-Id: I6b68da9da9c604adc4a1e39d9b98e764d96ca3a2

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# 8be0e6b5 06-May-2023 cww <cww@rock-chips.com>

rv1106: mcu: update sc4336/sc3336/sc3338/sc230ai/dual_sc3338 hpmcu tb bin to v1.65

build from commit:
rtt:d2d09ba#hal:d93ef9fd#battery_ipc:12da3e7

build from rt-thread commit in develop branch:

rv1106: mcu: update sc4336/sc3336/sc3338/sc230ai/dual_sc3338 hpmcu tb bin to v1.65

build from commit:
rtt:d2d09ba#hal:d93ef9fd#battery_ipc:12da3e7

build from rt-thread commit in develop branch:
d2d09ba: release RV1106/RV1103 RT-Thread SDK

build from hal commit in master branch:
d93ef9fd: device: rk3568: touch gic everytime in IRQ_HardIrqPreemptHandler

build from battery-ipc commit in master branch:
0534d87: fastae: sync with aiq v5.0x1.2-rc4

Signed-off-by: cww <cww@rock-chips.com>
Change-Id: Iefdc6ca6b288b1a4f47d2fa745122e09a2f13c22

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# 036b9020 04-Apr-2023 cww <cww@rock-chips.com>

rv1106: mcu: update gc3003/sc4336/sc3336/sc3338/sc230ai/dual_sc3338 hpmcu tb bin to v1.64

build from commit:
rtt:c6b03745b#hal:d93ef9fd#battery_ipc:12da3e7

build from rt-thread commit in develo

rv1106: mcu: update gc3003/sc4336/sc3336/sc3338/sc230ai/dual_sc3338 hpmcu tb bin to v1.64

build from commit:
rtt:c6b03745b#hal:d93ef9fd#battery_ipc:12da3e7

build from rt-thread commit in develop branch:
c6b03745b: bsp: rockchip: board: add dual sc3338 boardcfg

build from hal commit in master branch:
d93ef9fd: device: rk3568: touch gic everytime in IRQ_HardIrqPreemptHandler

build from battery-ipc commit in master branch:
12da3e7: fastae: support set secondary sensor mirror flip

Signed-off-by: cww <cww@rock-chips.com>
Change-Id: I49b153b6f7603838aba80ed4e676e73cdc4485f5

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# f1a9d362 12-Apr-2023 Joseph Chen <chenjh@rock-chips.com>

doc: release: Fix end line

Signed-off-by: Joseph Chen <chenjh@rock-chips.com>
Change-Id: Idf79cfbf55904bcfae8ae6beff4fc4921368c329


# 71653a91 31-Mar-2023 Wang Xiaobin <xb.wang@rock-chips.com>

rv1106: mcu: update gc2093 hpmcu tb bin to v1.64

build from commit:
rtt:bd3010959#hal:e2f3eac3#battery_ipc:61d3fb5

build from rt-thread commit in develop branch:
bd3010959: bsp: rockchip: b

rv1106: mcu: update gc2093 hpmcu tb bin to v1.64

build from commit:
rtt:bd3010959#hal:e2f3eac3#battery_ipc:61d3fb5

build from rt-thread commit in develop branch:
bd3010959: bsp: rockchip: board: rv1106_evb-SC3338-ADC add a gpio iomux

build from hal commit in master branch:
e2f3eac3: project: rk3358: add rpmsg-lite base support

build from battery-ipc commit in master branch:
61d3fb5: iq_parser_head: sync with AIQ V5.0x1.2-rc2

Signed-off-by: Wang Xiaobin <xb.wang@rock-chips.com>
Change-Id: Id89cafac5bb9f9a93a3d9086aef96076ee910f46

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# 5714bb7f 16-Mar-2023 Jon Lin <jon.lin@rock-chips.com>

rv1106: usbplug: Update to v1.07

from commit:
I6b73e5e src: spinand: Fix unnecessary QE for S35ML0xG3
update feature:
Support new spiflash.

Change-Id: Ic9a96bcf98ebe00951370fcacb28bd95eccf06ee
Si

rv1106: usbplug: Update to v1.07

from commit:
I6b73e5e src: spinand: Fix unnecessary QE for S35ML0xG3
update feature:
Support new spiflash.

Change-Id: Ic9a96bcf98ebe00951370fcacb28bd95eccf06ee
Signed-off-by: Jon Lin <jon.lin@rock-chips.com>

show more ...


# b957c293 21-Mar-2023 Wesley Yao <wesley.yao@rock-chips.com>

rv1106: ddr: Update DDR bin to v1.11 20230328

Build from:
285bced5c1 dram_init: rv1106: Update to v1.11

Update feature:
7c3a0782c9 drivers: ram: rv1106: Strengthen clk drv of QFN DDR3

Signed-off

rv1106: ddr: Update DDR bin to v1.11 20230328

Build from:
285bced5c1 dram_init: rv1106: Update to v1.11

Update feature:
7c3a0782c9 drivers: ram: rv1106: Strengthen clk drv of QFN DDR3

Signed-off-by: Wesley Yao <wesley.yao@rock-chips.com>
Change-Id: I22a1e128fb4ef8a0effd2049f728a2ae28014aa2

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# af7890d3 02-Mar-2023 Su Yuefu <yuefu.su@rock-chips.com>

rv1106: mcu: update gc3003/sc4336/sc3336/sc3338/sc230ai/dual_sc3338 hpmcu tb bin to v1.63

build from commit:
rtt:c6b03745b#hal:d93ef9fd#battery_ipc:f52bf08

build from rt-thread commit in develo

rv1106: mcu: update gc3003/sc4336/sc3336/sc3338/sc230ai/dual_sc3338 hpmcu tb bin to v1.63

build from commit:
rtt:c6b03745b#hal:d93ef9fd#battery_ipc:f52bf08

build from rt-thread commit in develop branch:
c6b03745b:bsp: rockchip: board: add dual sc3338 boardcfg

build from hal commit in master branch:
d93ef9fd:device: rk3568: touch gic everytime in IRQ_HardIrqPreemptHandler

build from battery-ipc commit in master branch:
f52bf08:fastae: v2.2.0 support dual sensor

Signed-off-by: Su Yuefu <yuefu.su@rock-chips.com>
Change-Id: I89d9e1aa794692b9dce73dd262e10d51a1a0e590

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# 72468bea 07-Mar-2023 Sisyphean Zhou <sisyphean.zhou@rock-chips.com>

rv1106: mcu: update gc2093 hpmcu tb bin to v1.63

build from commit:
rtt:831ea1368#hal:d93ef9fd#battery_ipc:12d4661

build from rt-thread commit in develop branch:
831ea1368:bsp: rock

rv1106: mcu: update gc2093 hpmcu tb bin to v1.63

build from commit:
rtt:831ea1368#hal:d93ef9fd#battery_ipc:12d4661

build from rt-thread commit in develop branch:
831ea1368:bsp: rockchip: camera: gc2093 add 1080P 25fps output

build from hal commit in master branch:
d93ef9fd:device: rk3568: touch gic everytime in IRQ_HardIrqPreemptHandler

build from battery-ipc commit in master branch:
12d4661:fastae: fix bug in soft light sensor

Signed-off-by: Sisyphean Zhou <sisyphean.zhou@rock-chips.com>
Change-Id: I20a57ae9e6d23b5c9fc142d7fe0727cfa23f0c0d

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# 1cfafa7b 16-Feb-2023 Sisyphean Zhou <sisyphean.zhou@rock-chips.com>

rv1106: mcu: update gc2093 hpmcu tb bin to v1.62

build from commit:
rtt:5a5a088d0#hal:d93ef9fd#battery_ipc:12d4661

build from rt-thread commit in develop branch:
5a5a088d0:rtt:gc300

rv1106: mcu: update gc2093 hpmcu tb bin to v1.62

build from commit:
rtt:5a5a088d0#hal:d93ef9fd#battery_ipc:12d4661

build from rt-thread commit in develop branch:
5a5a088d0:rtt:gc3003:fix set flip error

build from hal commit in master branch:
d93ef9fd:device: rk3568: touch gic everytime in IRQ_HardIrqPreemptHandler

build from battery-ipc commit in master branch:
12d4661:fastae: fix bug in soft light sensor

Change-Id: I8806b50f7faf0fa0fce2acbc1a7f3baadb06b4fb
Signed-off-by: Sisyphean Zhou <sisyphean.zhou@rock-chips.com>

show more ...


# 18157235 16-Feb-2023 Joseph Chen <chenjh@rock-chips.com>

doc: release: Fix coding style

Signed-off-by: Joseph Chen <chenjh@rock-chips.com>
Change-Id: I68f7e92bcce0e722a9ac4783c748d8c08de74245


# a65e0544 31-Jan-2023 chujin.zhou <chujin.zhou@rock-chips.com>

rv1106: mcu: update gc3003 sc230ai sc3336/sc3338 sc4336 hpmcu tb bin to v1.62

build from commit:
rtt:5a5a088d0#hal:d93ef9fd#battery_ipc:12d4661

build from rt-thread commit in develop branch:
5a5a

rv1106: mcu: update gc3003 sc230ai sc3336/sc3338 sc4336 hpmcu tb bin to v1.62

build from commit:
rtt:5a5a088d0#hal:d93ef9fd#battery_ipc:12d4661

build from rt-thread commit in develop branch:
5a5a088d0:rtt:gc3003:fix set flip error

build from hal commit in master branch:
d93ef9fd:device: rk3568: touch gic everytime in IRQ_HardIrqPreemptHandler

build from battery-ipc commit in master branch:
12d4661:fastae: fix bug in soft light sensor

Signed-off-by: chujin.zhou <chujin.zhou@rock-chips.com>
Change-Id: I78f78634cb65cdbbfd853ea51a90850cab767bac

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# eab1c39c 03-Jan-2023 Chuanhu Sun <aaron.sun@rock-chips.com>

rv1106: rv1106_hpmcu_wrap: update version to v1.54

build from rockit-ko commit in master branch:
69d42563 mcu_bin: update version to v1.5.4

build from hal commit in master branch:
a76806e7

rv1106: rv1106_hpmcu_wrap: update version to v1.54

build from rockit-ko commit in master branch:
69d42563 mcu_bin: update version to v1.5.4

build from hal commit in master branch:
a76806e7 project: common: riscv: change riscv toolchain to xpack

Signed-off-by: Chuanhu Sun <aaron.sun@rock-chips.com>
Change-Id: I927ccd49a5930fc7c8c7f7a801bbfba81051857f

show more ...


# 43fd302e 05-Jan-2023 chujin.zhou <chujin.zhou@rock-chips.com>

rv1106: mcu: update gc3003 sc230ai sc3336/sc3338 sc4336 hpmcu tb bin to v1.61

build from commit:
rtt:5a5a088d0#hal:d93ef9fd#battery_ipc:dacbbc1

build from rt-thread commit in develop branch:
5a5a

rv1106: mcu: update gc3003 sc230ai sc3336/sc3338 sc4336 hpmcu tb bin to v1.61

build from commit:
rtt:5a5a088d0#hal:d93ef9fd#battery_ipc:dacbbc1

build from rt-thread commit in develop branch:
5a5a088d0:rtt:gc3003:fix set flip error

build from hal commit in master branch:
d93ef9fd:device: rk3568: touch gic everytime in IRQ_HardIrqPreemptHandler

build from battery-ipc commit in master branch:
dacbbc1:fix bugs when working in always_on night mode

Signed-off-by: chujin.zhou <chujin.zhou@rock-chips.com>
Change-Id: If637f053d8b2dc749dbd140ee00ed49b9f0ab726

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# e9f64bb4 22-Dec-2022 chujin.zhou <chujin.zhou@rock-chips.com>

rv1106: mcu: update/add gc3003 sc230ai sc3336/sc3338 sc4336 hpmcu tb bin to v1.60

build from commit:
rtt:755701b24#hal:d93ef9fd#battery_ipc:18df679ea

build from rt-thread commit in develop branch:

rv1106: mcu: update/add gc3003 sc230ai sc3336/sc3338 sc4336 hpmcu tb bin to v1.60

build from commit:
rtt:755701b24#hal:d93ef9fd#battery_ipc:18df679ea

build from rt-thread commit in develop branch:
755701b24:bsp: rockchip: camera: gc3003 support get config from boardcfg

build from hal commit in master branch:
d93ef9fd:device: rk3568: touch gic everytime in IRQ_HardIrqPreemptHandler

build from battery-ipc commit in master branch:
18df679ea:meta: support config AE max frame rk_fastae_max_frame

Signed-off-by: chujin.zhou <chujin.zhou@rock-chips.com>
Change-Id: Ib676b0bf0e74b7589d39819d2010907e4dd48ab1

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# 35a0b2d1 10-Nov-2022 Su Yuefu <yuefu.su@rock-chips.com>

rv1106: mcu: update sc230ai sc3336/sc3338 gc3003 hpmcu tb bin to v1.50

build from commit:
rtt: a40f17d#hal:b569247#battery_ipc:c62dd55

build from rt-thread commit in develop branch:

rv1106: mcu: update sc230ai sc3336/sc3338 gc3003 hpmcu tb bin to v1.50

build from commit:
rtt: a40f17d#hal:b569247#battery_ipc:c62dd55

build from rt-thread commit in develop branch:
a40f17d: [components]: fix compile error without rt_kprintf

build from hal commit in master branch:
b569247: lib: hal: cru: rk3588: Fix select rate from osc24m

build from battery-ipc commit in master branch:
c62dd55: limit 8 frames to calculate AE

Signed-off-by: Su Yuefu <yuefu.su@rock-chips.com>
Change-Id: I598ad1e788b46929256109655b7517032c513299

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# 1e31d4c8 16-Nov-2022 Chuanhu Sun <aaron.sun@rock-chips.com>

rv1106: rv1106_hpmcu_wrap: update version to v1.53

build from rockit-ko commit in master branch:
c9653fe9 hpmcu: update version to v1.5.3

build from hal commit in master branch:
a76806e7 pr

rv1106: rv1106_hpmcu_wrap: update version to v1.53

build from rockit-ko commit in master branch:
c9653fe9 hpmcu: update version to v1.5.3

build from hal commit in master branch:
a76806e7 project: common: riscv: change riscv toolchain to xpack

Signed-off-by: Chuanhu Sun <aaron.sun@rock-chips.com>
Change-Id: I3e3d75ac1bfc0cfb14d239ea74ce7a1fdb154ba2

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