xref: /rk3399_ARM-atf/docs/plat/stm32mp1.rst (revision 975cf6ff5105530f3b05cbf2529c703cb5d16549) 
1STMicroelectronics STM32MP1
2===========================
3
4STM32MP1 is a microprocessor designed by STMicroelectronics
5based on a dual Arm Cortex-A7.
6It is an Armv7-A platform, using dedicated code from TF-A.
7The STM32MP1 chip also embeds a Cortex-M4.
8More information can be found on `STM32MP1 Series`_ page.
9
10
11STM32MP1 Versions
12-----------------
13The STM32MP1 series is available in 3 different lines which are pin-to-pin compatible:
14
15- STM32MP157: Dual Cortex-A7 cores, Cortex-M4 core @ 209 MHz, 3D GPU, DSI display interface and CAN FD
16- STM32MP153: Dual Cortex-A7 cores, Cortex-M4 core @ 209 MHz and CAN FD
17- STM32MP151: Single Cortex-A7 core, Cortex-M4 core @ 209 MHz
18
19Each line comes with a security option (cryptography & secure boot) and a Cortex-A frequency option:
20
21- A      Basic + Cortex-A7 @ 650 MHz
22- C      Secure Boot + HW Crypto + Cortex-A7 @ 650 MHz
23- D      Basic + Cortex-A7 @ 800 MHz
24- F      Secure Boot + HW Crypto + Cortex-A7 @ 800 MHz
25
26The `STM32MP1 part number codification`_ page gives more information about part numbers.
27
28Design
29------
30The STM32MP1 resets in the ROM code of the Cortex-A7.
31The primary boot core (core 0) executes the boot sequence while
32secondary boot core (core 1) is kept in a holding pen loop.
33The ROM code boot sequence loads the TF-A binary image from boot device
34to embedded SRAM.
35
36The TF-A image must be properly formatted with a STM32 header structure
37for ROM code is able to load this image.
38Tool stm32image can be used to prepend this header to the generated TF-A binary.
39
40Boot with FIP
41~~~~~~~~~~~~~
42The use of FIP is now the recommended way to boot STM32MP1 platform.
43Only BL2 (with STM32 header) is loaded by ROM code. The other binaries are
44inside the FIP binary: BL32 (SP_min or OP-TEE), U-Boot and their respective
45device tree blobs.
46
47STM32IMAGE bootchain
48~~~~~~~~~~~~~~~~~~~~
49Although still supported, this way of booting is not recommended.
50Pease use FIP instead.
51At compilation step, BL2, BL32 and DTB file are linked together in a single
52binary. The stm32image tool is also generated and the header is added to TF-A
53binary. This binary file with header is named tf-a-stm32mp157c-ev1.stm32.
54It can then be copied in the first partition of the boot device.
55
56
57Memory mapping
58~~~~~~~~~~~~~~
59
60::
61
62    0x00000000 +-----------------+
63               |                 |   ROM
64    0x00020000 +-----------------+
65               |                 |
66               |       ...       |
67               |                 |
68    0x2FFC0000 +-----------------+ \
69               |     BL32 DTB    | |
70    0x2FFC5000 +-----------------+ |
71               |       BL32      | |
72    0x2FFDF000 +-----------------+ |
73               |       ...       | |
74    0x2FFE3000 +-----------------+ |
75               |     BL2 DTB     | | Embedded SRAM
76    0x2FFEA000 +-----------------+ |
77               |       BL2       | |
78    0x2FFFF000 +-----------------+ |
79               |  SCMI mailbox   | |
80    0x30000000 +-----------------+ /
81               |                 |
82               |       ...       |
83               |                 |
84    0x40000000 +-----------------+
85               |                 |
86               |                 |   Devices
87               |                 |
88    0xC0000000 +-----------------+ \
89               |                 | |
90    0xC0100000 +-----------------+ |
91               |       BL33      | | Non-secure RAM (DDR)
92               |       ...       | |
93               |                 | |
94    0xFFFFFFFF +-----------------+ /
95
96
97Boot sequence
98~~~~~~~~~~~~~
99
100ROM code -> BL2 (compiled with BL2_AT_EL3) -> BL32 (SP_min) -> BL33 (U-Boot)
101
102or if Op-TEE is used:
103
104ROM code -> BL2 (compiled with BL2_AT_EL3) -> OP-TEE -> BL33 (U-Boot)
105
106
107Build Instructions
108------------------
109Boot media(s) supported by BL2 must be specified in the build command.
110Available storage medias are:
111
112- ``STM32MP_SDMMC``
113- ``STM32MP_EMMC``
114- ``STM32MP_RAW_NAND``
115- ``STM32MP_SPI_NAND``
116- ``STM32MP_SPI_NOR``
117
118Serial boot devices:
119
120- ``STM32MP_UART_PROGRAMMER``
121- ``STM32MP_USB_PROGRAMMER``
122
123
124Other configuration flags:
125
126- | ``DTB_FILE_NAME``: to precise board device-tree blob to be used.
127  | Default: stm32mp157c-ev1.dtb
128- | ``STM32MP_EARLY_CONSOLE``: to enable early traces before clock driver is setup.
129  | Default: 0 (disabled)
130- | ``STM32_TF_VERSION``: to manage BL2 monotonic counter.
131  | Default: 0
132
133
134Boot with FIP
135~~~~~~~~~~~~~
136You need to build BL2, BL32 (SP_min or OP-TEE) and BL33 (U-Boot) before building FIP binary.
137
138U-Boot
139______
140
141.. code:: bash
142
143    cd <u-boot_directory>
144    make stm32mp15_trusted_defconfig
145    make DEVICE_TREE=stm32mp157c-ev1 all
146
147OP-TEE (optional)
148_________________
149
150.. code:: bash
151
152    cd <optee_directory>
153    make CROSS_COMPILE=arm-linux-gnueabihf- ARCH=arm PLATFORM=stm32mp1 \
154        CFG_EMBED_DTB_SOURCE_FILE=stm32mp157c-ev1.dts
155
156
157TF-A BL32 (SP_min)
158__________________
159If you choose not to use OP-TEE, you can use TF-A SP_min.
160To build TF-A BL32, and its device tree file:
161
162.. code:: bash
163
164    make CROSS_COMPILE=arm-none-eabi- PLAT=stm32mp1 ARCH=aarch32 ARM_ARCH_MAJOR=7 \
165        AARCH32_SP=sp_min DTB_FILE_NAME=stm32mp157c-ev1.dtb bl32 dtbs
166
167TF-A BL2
168________
169To build TF-A BL2 with its STM32 header for SD-card boot:
170
171.. code:: bash
172
173    make CROSS_COMPILE=arm-none-eabi- PLAT=stm32mp1 ARCH=aarch32 ARM_ARCH_MAJOR=7 \
174        DTB_FILE_NAME=stm32mp157c-ev1.dtb STM32MP_SDMMC=1
175
176For other boot devices, you have to replace STM32MP_SDMMC in the previous command
177with the desired device flag.
178
179This BL2 is independent of the BL32 used (SP_min or OP-TEE)
180
181
182FIP
183___
184With BL32 SP_min:
185
186.. code:: bash
187
188    make CROSS_COMPILE=arm-none-eabi- PLAT=stm32mp1 ARCH=aarch32 ARM_ARCH_MAJOR=7 \
189        AARCH32_SP=sp_min \
190        DTB_FILE_NAME=stm32mp157c-ev1.dtb \
191        BL33=<u-boot_directory>/u-boot-nodtb.bin \
192        BL33_CFG=<u-boot_directory>/u-boot.dtb \
193        fip
194
195With OP-TEE:
196
197.. code:: bash
198
199    make CROSS_COMPILE=arm-none-eabi- PLAT=stm32mp1 ARCH=aarch32 ARM_ARCH_MAJOR=7 \
200        AARCH32_SP=optee \
201        DTB_FILE_NAME=stm32mp157c-ev1.dtb \
202        BL33=<u-boot_directory>/u-boot-nodtb.bin \
203        BL33_CFG=<u-boot_directory>/u-boot.dtb \
204        BL32=<optee_directory>/tee-header_v2.bin \
205        BL32_EXTRA1=<optee_directory>/tee-pager_v2.bin
206        BL32_EXTRA2=<optee_directory>/tee-pageable_v2.bin
207        fip
208
209
210STM32IMAGE bootchain
211~~~~~~~~~~~~~~~~~~~~
212You need to add the following flag to the make command:
213``STM32MP_USE_STM32IMAGE=1``
214
215To build with SP_min and support for SD-card boot:
216
217.. code:: bash
218
219    make CROSS_COMPILE=arm-linux-gnueabihf- PLAT=stm32mp1 ARCH=aarch32 ARM_ARCH_MAJOR=7 \
220        AARCH32_SP=sp_min STM32MP_SDMMC=1 DTB_FILE_NAME=stm32mp157c-ev1.dtb \
221        STM32MP_USE_STM32IMAGE=1
222
223    cd <u-boot_directory>
224    make stm32mp15_trusted_defconfig
225    make DEVICE_TREE=stm32mp157c-ev1 all
226
227To build TF-A with OP-TEE support for SD-card boot:
228
229.. code:: bash
230
231    make CROSS_COMPILE=arm-linux-gnueabihf- PLAT=stm32mp1 ARCH=aarch32 ARM_ARCH_MAJOR=7 \
232        AARCH32_SP=optee STM32MP_SDMMC=1 DTB_FILE_NAME=stm32mp157c-ev1.dtb \
233        STM32MP_USE_STM32IMAGE=1
234
235    cd <optee_directory>
236    make CROSS_COMPILE=arm-linux-gnueabihf- ARCH=arm PLATFORM=stm32mp1 \
237        CFG_EMBED_DTB_SOURCE_FILE=stm32mp157c-ev1.dts
238
239    cd <u-boot_directory>
240    make stm32mp15_trusted_defconfig
241    make DEVICE_TREE=stm32mp157c-ev1 all
242
243
244The following build options are supported:
245
246- ``ENABLE_STACK_PROTECTOR``: To enable the stack protection.
247
248
249Populate SD-card
250----------------
251
252Boot with FIP
253~~~~~~~~~~~~~
254The SD-card has to be formatted with GPT.
255It should contain at least those partitions:
256
257- fsbl: to copy the tf-a-stm32mp157c-ev1.stm32 binary (BL2)
258- fip: which contains the FIP binary
259
260Usually, two copies of fsbl are used (fsbl1 and fsbl2) instead of one partition fsbl.
261
262STM32IMAGE bootchain
263~~~~~~~~~~~~~~~~~~~~
264The SD-card has to be formatted with GPT.
265It should contain at least those partitions:
266
267- fsbl: to copy the tf-a-stm32mp157c-ev1.stm32 binary
268- ssbl: to copy the u-boot.stm32 binary
269
270Usually, two copies of fsbl are used (fsbl1 and fsbl2) instead of one partition fsbl.
271
272OP-TEE artifacts go into separate partitions as follows:
273
274- teeh: tee-header_v2.stm32
275- teed: tee-pageable_v2.stm32
276- teex: tee-pager_v2.stm32
277
278
279.. _STM32MP1 Series: https://www.st.com/en/microcontrollers-microprocessors/stm32mp1-series.html
280.. _STM32MP1 part number codification: https://wiki.st.com/stm32mpu/wiki/STM32MP15_microprocessor#Part_number_codification
281