| #
ab9d4193 |
| 06-Feb-2024 |
Jon Lin <jon.lin@rock-chips.com> |
rv1106: usbplug: Update to v1.09
from commit:
20b8d8f8d src: spinand: Support new device W25N01JWZEIG
update feature:
Support new SPI Flash
Change-Id: I458b0639a299722ffa3b69522b80248717f9f2ff
Si
rv1106: usbplug: Update to v1.09
from commit:
20b8d8f8d src: spinand: Support new device W25N01JWZEIG
update feature:
Support new SPI Flash
Change-Id: I458b0639a299722ffa3b69522b80248717f9f2ff
Signed-off-by: Jon Lin <jon.lin@rock-chips.com>
show more ...
|
| #
cdb53886 |
| 13-Dec-2023 |
Wesley Yao <wesley.yao@rock-chips.com> |
rv1106: ddr: Update to v1.15 20231221
Build from:
306b9977f5 dram_init: rv1106: Upadate to v1.15
Update features:
cf081b2cc5 dram_init: timer: Initialize hptimer as soft adjust mode in RV1106
fe
rv1106: ddr: Update to v1.15 20231221
Build from:
306b9977f5 dram_init: rv1106: Upadate to v1.15
Update features:
cf081b2cc5 dram_init: timer: Initialize hptimer as soft adjust mode in RV1106
fefaf6ae79 rv1106: ddr: Do not reinit hp_timer in resume_flow
617232e4e1 drivers: ram: rv1106: Change PVTPLL length to 7
43bdca99ff dram_init: Add BROM_BOOTSOURCE_IS_DOWNLOAD macro
58e29ce5b4 drivers: ram: rv1106: Fix maskrom bug
204a8810e6 drivers: ram: rockchip: remove DDR2/DDR3 Die bus-width log
Signed-off-by: Wesley Yao <wesley.yao@rock-chips.com>
Change-Id: Ie4ffc308cfdaf890c3f78c54b0f111a74ee7bd1f
show more ...
|
| #
9b04c27a |
| 15-Dec-2023 |
Weiwen Chen <cww@rock-chips.com> |
rv1106: mcu: update hpmcu tb bin to v1.90
build from commit:
rtt:e31465907#hal:8966acbf#battery_ipc:1497fb5
build from rt-thread commit in develop branch:
e31465907: bsp: rockchip: camera:
rv1106: mcu: update hpmcu tb bin to v1.90
build from commit:
rtt:e31465907#hal:8966acbf#battery_ipc:1497fb5
build from rt-thread commit in develop branch:
e31465907: bsp: rockchip: camera: fix mclk is not in effect
build from hal commit in master branch:
8966acbf: rv1106-mcu: Optimize bss zero init time cost
build from battery-ipc commit in master branch:
1497fb5: fastae: 2.3.2-rc1
Signed-off-by: Weiwen Chen <cww@rock-chips.com>
Change-Id: I24fe88a2ea241768c7a9a7ae155efbce12e7ec37
show more ...
|
| #
f531f809 |
| 15-Nov-2023 |
Weiwen Chen <cww@rock-chips.com> |
rv1106: mcu: update hpmcu tb bin to v1.80
build from commit:
rtt:e31465907#hal:8966acbf#battery_ipc:0766081
build from rt-thread commit in develop branch:
e31465907: bsp: rockchip: camera:
rv1106: mcu: update hpmcu tb bin to v1.80
build from commit:
rtt:e31465907#hal:8966acbf#battery_ipc:0766081
build from rt-thread commit in develop branch:
e31465907: bsp: rockchip: camera: fix mclk is not in effect
build from hal commit in master branch:
8966acbf: rv1106-mcu: Optimize bss zero init time cost
build from battery-ipc commit in master branch:
0766081: md: fix iso overflow
Signed-off-by: Weiwen Chen <cww@rock-chips.com>
Change-Id: I5eb0f77d6e27701c56e1639b35fbd8c425754b2b
show more ...
|
| #
b4a5167b |
| 24-Oct-2023 |
Wesley Yao <wesley.yao@rock-chips.com> |
rv1106: ddr: Update DDR bin to v1.14 20231024
Build from:
1df264c461 dram_init: rv1106: Change CFG_VERSION from V1.14 to v1.14
Update features:
60cd8a05aa dram_init: rv1106: Upadate to v1.14
a33
rv1106: ddr: Update DDR bin to v1.14 20231024
Build from:
1df264c461 dram_init: rv1106: Change CFG_VERSION from V1.14 to v1.14
Update features:
60cd8a05aa dram_init: rv1106: Upadate to v1.14
a33ae16d09 drivers: ram: rv1106: Adjust SI info of BGA DDR3
cef2fb4a30 drivers: ram: rv1106: Raise vref_out when wr trn of BGA DDR3
1db2fd720d drivers: ram: rv1106: Adjust SI info of DDR4
b58f8e70ca drivers: ram: rv1106: Add fwver support
Signed-off-by: Wesley Yao <wesley.yao@rock-chips.com>
Change-Id: Ic814c33de3a39f9c1c62ed4dc946a7cdfea4dac9
show more ...
|
| #
6d00a9d2 |
| 10-Oct-2023 |
Jon Lin <jon.lin@rock-chips.com> |
rv1106: usbplug: Update to v1.08
from commit:
I0043a8b1 Revert "src: spinand: Support 4KB page for new IDB"
update feature:
Revert "src: spinand: Support 4KB page for new IDB"
Change-Id: I27b89a3
rv1106: usbplug: Update to v1.08
from commit:
I0043a8b1 Revert "src: spinand: Support 4KB page for new IDB"
update feature:
Revert "src: spinand: Support 4KB page for new IDB"
Change-Id: I27b89a31d60f85303bfc53bb2852d18fe78170db
Signed-off-by: Jon Lin <jon.lin@rock-chips.com>
show more ...
|
| #
a7a492ad |
| 15-Aug-2023 |
Weiwen Chen <cww@rock-chips.com> |
rv1106: mcu: update hpmcu tb bin to v1.70
build from commit:
rtt:b753ad6#hal:d93ef9fd#battery_ipc:7ca1398
build from rt-thread commit in develop branch:
b753ad6: bsp: rockchip: cameras: upd
rv1106: mcu: update hpmcu tb bin to v1.70
build from commit:
rtt:b753ad6#hal:d93ef9fd#battery_ipc:7ca1398
build from rt-thread commit in develop branch:
b753ad6: bsp: rockchip: cameras: update sc230ai again map
build from hal commit in master branch:
d93ef9fd: device: rk3568: touch gic everytime in IRQ_HardIrqPreemptHandler
build from battery-ipc commit in master branch:
7ca1398: fastae: update 2.2.4 version
Signed-off-by: Weiwen Chen <cww@rock-chips.com>
Change-Id: I9ab7a036165f94dcefd56914f2c4caa3ec8bab0c
show more ...
|
| #
76d981cd |
| 31-Jul-2023 |
cww <cww@rock-chips.com> |
rv1106: mcu: update hpmcu tb bin to v1.69
build from commit:
rtt:b753ad6#hal:d93ef9fd#battery_ipc:1ced039
build from rt-thread commit in develop branch:
b753ad6: bsp: rockchip: cameras: upd
rv1106: mcu: update hpmcu tb bin to v1.69
build from commit:
rtt:b753ad6#hal:d93ef9fd#battery_ipc:1ced039
build from rt-thread commit in develop branch:
b753ad6: bsp: rockchip: cameras: update sc230ai again map
build from hal commit in master branch:
d93ef9fd: device: rk3568: touch gic everytime in IRQ_HardIrqPreemptHandler
build from battery-ipc commit in master branch:
1ced039: fastae: update 2.2.3 version
Signed-off-by: cww <cww@rock-chips.com>
Change-Id: Id36563e24d4f6918e22f6d2ebf3783d3a350198b
show more ...
|
| #
2c88cc70 |
| 04-Jul-2023 |
Ziyuan Xu <xzy.xu@rock-chips.com> |
rv1106: mcu: update hpmcu tb bin to v1.68
build from commit:
rtt:097fece7#hal:d93ef9fd#battery_ipc:21165ac
build from rt-thread commit in develop branch:
097fece77d bsp: rockchip: rv1106-mc
rv1106: mcu: update hpmcu tb bin to v1.68
build from commit:
rtt:097fece7#hal:d93ef9fd#battery_ipc:21165ac
build from rt-thread commit in develop branch:
097fece77d bsp: rockchip: rv1106-mcu: board: use pstore-mcu-log as console_output
build from hal commit in master branch:
d93ef9fd: device: rk3568: touch gic everytime in IRQ_HardIrqPreemptHandler
build from battery-ipc commit in master branch:
21165ac fix print log condition
Signed-off-by: Ziyuan Xu <xzy.xu@rock-chips.com>
Change-Id: Ifa3da1c8d2468a6905ab416d8a25937385ff9021
show more ...
|
| #
431b8663 |
| 10-Jul-2023 |
Wesley Yao <wesley.yao@rock-chips.com> |
rv1106: ddr: Update DDR bin to v1.13 20230710
Build from:
37a6671fc7 dram_init: rv1106: Update to v1.13
Update feature:
be7129d2d5 drivers: ram: rv1106: Support resume
Signed-off-by: Wesley Yao
rv1106: ddr: Update DDR bin to v1.13 20230710
Build from:
37a6671fc7 dram_init: rv1106: Update to v1.13
Update feature:
be7129d2d5 drivers: ram: rv1106: Support resume
Signed-off-by: Wesley Yao <wesley.yao@rock-chips.com>
Change-Id: Ib26434a5149e9a992d80203b5d9350a9835c2875
show more ...
|
| #
4d61e7f8 |
| 21-Jun-2023 |
Ziyuan Xu <xzy.xu@rock-chips.com> |
rv1106: mcu: update hpmcu tb bin to v1.67
build from commit:
rtt:f047d6a191#hal:d93ef9fd#battery_ipc:68c599d
build from rt-thread commit in develop branch:
f047d6a1: [Tools]: add battery-ip
rv1106: mcu: update hpmcu tb bin to v1.67
build from commit:
rtt:f047d6a191#hal:d93ef9fd#battery_ipc:68c599d
build from rt-thread commit in develop branch:
f047d6a1: [Tools]: add battery-ipc repository version information
build from hal commit in master branch:
d93ef9fd: device: rk3568: touch gic everytime in IRQ_HardIrqPreemptHandler
build from battery-ipc commit in master branch:
68c599d: fast_ae: fix compile warning
Signed-off-by: Ziyuan Xu <xzy.xu@rock-chips.com>
Change-Id: Ib4333e09a9e8cf6a3d3ace1b410bb6d63baa7971
show more ...
|
| #
939d1016 |
| 07-Jun-2023 |
Weiwen Chen <cww@rock-chips.com> |
rv1106: mcu: update sc4336/sc3336/sc3338/sc230ai/dual_sc3338 hpmcu tb bin to v1.66
build from commit:
rtt:07ac6e9#hal:d93ef9fd#battery_ipc:04a4e08
build from rt-thread commit in develop branch:
rv1106: mcu: update sc4336/sc3336/sc3338/sc230ai/dual_sc3338 hpmcu tb bin to v1.66
build from commit:
rtt:07ac6e9#hal:d93ef9fd#battery_ipc:04a4e08
build from rt-thread commit in develop branch:
07ac6e9: bsp: rockchip: camera: conver reg list to support i2c continuous writing
build from hal commit in master branch:
d93ef9fd: device: rk3568: touch gic everytime in IRQ_HardIrqPreemptHandler
build from battery-ipc commit in master branch:
04a4e08: fastae: sync with aiq v5.0x1.2-rc5
Signed-off-by: Weiwen Chen <cww@rock-chips.com>
Change-Id: I45618153cedff67c7595e6377a68d63c0eb936ef
show more ...
|
| #
10d78d1d |
| 31-May-2023 |
Wesley Yao <wesley.yao@rock-chips.com> |
rv1106: ddr: Update DDR bin to v1.12 20230531
Build from:
6cf9a2f250 dram_init: rv1106: Update to v1.12
Update feature:
dd6f7dc7c6 drivers: ram: rv1106: Fast exit (DLL on) for power down on DDR3
rv1106: ddr: Update DDR bin to v1.12 20230531
Build from:
6cf9a2f250 dram_init: rv1106: Update to v1.12
Update feature:
dd6f7dc7c6 drivers: ram: rv1106: Fast exit (DLL on) for power down on DDR3
76b28dbce9 drivers: ram: rv1106: Support modify refresh rate in loader_params
ed9d2f002f drivers: ram: rv1106: Fix calc of cs_pst
5af756bb61 drivers: ram: rv1106: Add print when distinguishing DDR2 from DDR3
Signed-off-by: Wesley Yao <wesley.yao@rock-chips.com>
Change-Id: I87dd6ceb87479c5827c2957fa057e5b4b8afd359
show more ...
|
| #
8be0e6b5 |
| 06-May-2023 |
cww <cww@rock-chips.com> |
rv1106: mcu: update sc4336/sc3336/sc3338/sc230ai/dual_sc3338 hpmcu tb bin to v1.65
build from commit:
rtt:d2d09ba#hal:d93ef9fd#battery_ipc:12da3e7
build from rt-thread commit in develop branch:
rv1106: mcu: update sc4336/sc3336/sc3338/sc230ai/dual_sc3338 hpmcu tb bin to v1.65
build from commit:
rtt:d2d09ba#hal:d93ef9fd#battery_ipc:12da3e7
build from rt-thread commit in develop branch:
d2d09ba: release RV1106/RV1103 RT-Thread SDK
build from hal commit in master branch:
d93ef9fd: device: rk3568: touch gic everytime in IRQ_HardIrqPreemptHandler
build from battery-ipc commit in master branch:
0534d87: fastae: sync with aiq v5.0x1.2-rc4
Signed-off-by: cww <cww@rock-chips.com>
Change-Id: Iefdc6ca6b288b1a4f47d2fa745122e09a2f13c22
show more ...
|
| #
036b9020 |
| 04-Apr-2023 |
cww <cww@rock-chips.com> |
rv1106: mcu: update gc3003/sc4336/sc3336/sc3338/sc230ai/dual_sc3338 hpmcu tb bin to v1.64
build from commit:
rtt:c6b03745b#hal:d93ef9fd#battery_ipc:12da3e7
build from rt-thread commit in develo
rv1106: mcu: update gc3003/sc4336/sc3336/sc3338/sc230ai/dual_sc3338 hpmcu tb bin to v1.64
build from commit:
rtt:c6b03745b#hal:d93ef9fd#battery_ipc:12da3e7
build from rt-thread commit in develop branch:
c6b03745b: bsp: rockchip: board: add dual sc3338 boardcfg
build from hal commit in master branch:
d93ef9fd: device: rk3568: touch gic everytime in IRQ_HardIrqPreemptHandler
build from battery-ipc commit in master branch:
12da3e7: fastae: support set secondary sensor mirror flip
Signed-off-by: cww <cww@rock-chips.com>
Change-Id: I49b153b6f7603838aba80ed4e676e73cdc4485f5
show more ...
|
| #
5714bb7f |
| 16-Mar-2023 |
Jon Lin <jon.lin@rock-chips.com> |
rv1106: usbplug: Update to v1.07
from commit:
I6b73e5e src: spinand: Fix unnecessary QE for S35ML0xG3
update feature:
Support new spiflash.
Change-Id: Ic9a96bcf98ebe00951370fcacb28bd95eccf06ee
Si
rv1106: usbplug: Update to v1.07
from commit:
I6b73e5e src: spinand: Fix unnecessary QE for S35ML0xG3
update feature:
Support new spiflash.
Change-Id: Ic9a96bcf98ebe00951370fcacb28bd95eccf06ee
Signed-off-by: Jon Lin <jon.lin@rock-chips.com>
show more ...
|
| #
b957c293 |
| 21-Mar-2023 |
Wesley Yao <wesley.yao@rock-chips.com> |
rv1106: ddr: Update DDR bin to v1.11 20230328
Build from:
285bced5c1 dram_init: rv1106: Update to v1.11
Update feature:
7c3a0782c9 drivers: ram: rv1106: Strengthen clk drv of QFN DDR3
Signed-off
rv1106: ddr: Update DDR bin to v1.11 20230328
Build from:
285bced5c1 dram_init: rv1106: Update to v1.11
Update feature:
7c3a0782c9 drivers: ram: rv1106: Strengthen clk drv of QFN DDR3
Signed-off-by: Wesley Yao <wesley.yao@rock-chips.com>
Change-Id: I22a1e128fb4ef8a0effd2049f728a2ae28014aa2
show more ...
|
| #
af7890d3 |
| 02-Mar-2023 |
Su Yuefu <yuefu.su@rock-chips.com> |
rv1106: mcu: update gc3003/sc4336/sc3336/sc3338/sc230ai/dual_sc3338 hpmcu tb bin to v1.63
build from commit:
rtt:c6b03745b#hal:d93ef9fd#battery_ipc:f52bf08
build from rt-thread commit in develo
rv1106: mcu: update gc3003/sc4336/sc3336/sc3338/sc230ai/dual_sc3338 hpmcu tb bin to v1.63
build from commit:
rtt:c6b03745b#hal:d93ef9fd#battery_ipc:f52bf08
build from rt-thread commit in develop branch:
c6b03745b:bsp: rockchip: board: add dual sc3338 boardcfg
build from hal commit in master branch:
d93ef9fd:device: rk3568: touch gic everytime in IRQ_HardIrqPreemptHandler
build from battery-ipc commit in master branch:
f52bf08:fastae: v2.2.0 support dual sensor
Signed-off-by: Su Yuefu <yuefu.su@rock-chips.com>
Change-Id: I89d9e1aa794692b9dce73dd262e10d51a1a0e590
show more ...
|
| #
a65e0544 |
| 31-Jan-2023 |
chujin.zhou <chujin.zhou@rock-chips.com> |
rv1106: mcu: update gc3003 sc230ai sc3336/sc3338 sc4336 hpmcu tb bin to v1.62
build from commit:
rtt:5a5a088d0#hal:d93ef9fd#battery_ipc:12d4661
build from rt-thread commit in develop branch:
5a5a
rv1106: mcu: update gc3003 sc230ai sc3336/sc3338 sc4336 hpmcu tb bin to v1.62
build from commit:
rtt:5a5a088d0#hal:d93ef9fd#battery_ipc:12d4661
build from rt-thread commit in develop branch:
5a5a088d0:rtt:gc3003:fix set flip error
build from hal commit in master branch:
d93ef9fd:device: rk3568: touch gic everytime in IRQ_HardIrqPreemptHandler
build from battery-ipc commit in master branch:
12d4661:fastae: fix bug in soft light sensor
Signed-off-by: chujin.zhou <chujin.zhou@rock-chips.com>
Change-Id: I78f78634cb65cdbbfd853ea51a90850cab767bac
show more ...
|
| #
43fd302e |
| 05-Jan-2023 |
chujin.zhou <chujin.zhou@rock-chips.com> |
rv1106: mcu: update gc3003 sc230ai sc3336/sc3338 sc4336 hpmcu tb bin to v1.61
build from commit:
rtt:5a5a088d0#hal:d93ef9fd#battery_ipc:dacbbc1
build from rt-thread commit in develop branch:
5a5a
rv1106: mcu: update gc3003 sc230ai sc3336/sc3338 sc4336 hpmcu tb bin to v1.61
build from commit:
rtt:5a5a088d0#hal:d93ef9fd#battery_ipc:dacbbc1
build from rt-thread commit in develop branch:
5a5a088d0:rtt:gc3003:fix set flip error
build from hal commit in master branch:
d93ef9fd:device: rk3568: touch gic everytime in IRQ_HardIrqPreemptHandler
build from battery-ipc commit in master branch:
dacbbc1:fix bugs when working in always_on night mode
Signed-off-by: chujin.zhou <chujin.zhou@rock-chips.com>
Change-Id: If637f053d8b2dc749dbd140ee00ed49b9f0ab726
show more ...
|
| #
e9f64bb4 |
| 22-Dec-2022 |
chujin.zhou <chujin.zhou@rock-chips.com> |
rv1106: mcu: update/add gc3003 sc230ai sc3336/sc3338 sc4336 hpmcu tb bin to v1.60
build from commit:
rtt:755701b24#hal:d93ef9fd#battery_ipc:18df679ea
build from rt-thread commit in develop branch:
rv1106: mcu: update/add gc3003 sc230ai sc3336/sc3338 sc4336 hpmcu tb bin to v1.60
build from commit:
rtt:755701b24#hal:d93ef9fd#battery_ipc:18df679ea
build from rt-thread commit in develop branch:
755701b24:bsp: rockchip: camera: gc3003 support get config from boardcfg
build from hal commit in master branch:
d93ef9fd:device: rk3568: touch gic everytime in IRQ_HardIrqPreemptHandler
build from battery-ipc commit in master branch:
18df679ea:meta: support config AE max frame rk_fastae_max_frame
Signed-off-by: chujin.zhou <chujin.zhou@rock-chips.com>
Change-Id: Ib676b0bf0e74b7589d39819d2010907e4dd48ab1
show more ...
|