Searched hist:cf34822750e7a066bf54ede3d329697f2f8ab815 (Results 1 – 4 of 4) sorted by relevance
| /rkbin/RKBOOT/ |
| H A D | RK3566MINIALL_NAND.ini | cf34822750e7a066bf54ede3d329697f2f8ab815 Fri Jun 21 02:21:23 UTC 2024 Tang Yun ping <typ@rock-chips.com> rk3566: ddr: update ddrbin to v1.22
build from:
f8ac117e9c rk356x: ddr: fix eyescan build fail
build command:
./make.sh rk3568
update feature:
1. fix probabilistic read/write training failures under DDR4 2cs
introduced in ddrbin v1.21.
2. Fixed some DRAM compatibility issues at LP4x low frequency.
3. Undo vref training below 600MHz
4. The CLK/DQS slew rate supports different values at high and low frequencies.
5. Added DRAM Manufacturer ID printing.
6. DDR4 enable LPASR to reduce DDR4 self-refresh power.
Signed-off-by: Tang Yun ping <typ@rock-chips.com>
Change-Id: I0977c713416a3614ec1b22f40cfb7ba9dbaa188c
|
| H A D | RK3566MINIALL.ini | cf34822750e7a066bf54ede3d329697f2f8ab815 Fri Jun 21 02:21:23 UTC 2024 Tang Yun ping <typ@rock-chips.com> rk3566: ddr: update ddrbin to v1.22
build from:
f8ac117e9c rk356x: ddr: fix eyescan build fail
build command:
./make.sh rk3568
update feature:
1. fix probabilistic read/write training failures under DDR4 2cs
introduced in ddrbin v1.21.
2. Fixed some DRAM compatibility issues at LP4x low frequency.
3. Undo vref training below 600MHz
4. The CLK/DQS slew rate supports different values at high and low frequencies.
5. Added DRAM Manufacturer ID printing.
6. DDR4 enable LPASR to reduce DDR4 self-refresh power.
Signed-off-by: Tang Yun ping <typ@rock-chips.com>
Change-Id: I0977c713416a3614ec1b22f40cfb7ba9dbaa188c
|
| /rkbin/doc/release/ |
| H A D | RK3566_EN.md | cf34822750e7a066bf54ede3d329697f2f8ab815 Fri Jun 21 02:21:23 UTC 2024 Tang Yun ping <typ@rock-chips.com> rk3566: ddr: update ddrbin to v1.22
build from:
f8ac117e9c rk356x: ddr: fix eyescan build fail
build command:
./make.sh rk3568
update feature:
1. fix probabilistic read/write training failures under DDR4 2cs
introduced in ddrbin v1.21.
2. Fixed some DRAM compatibility issues at LP4x low frequency.
3. Undo vref training below 600MHz
4. The CLK/DQS slew rate supports different values at high and low frequencies.
5. Added DRAM Manufacturer ID printing.
6. DDR4 enable LPASR to reduce DDR4 self-refresh power.
Signed-off-by: Tang Yun ping <typ@rock-chips.com>
Change-Id: I0977c713416a3614ec1b22f40cfb7ba9dbaa188c
|
| H A D | RK3566_CN.md | cf34822750e7a066bf54ede3d329697f2f8ab815 Fri Jun 21 02:21:23 UTC 2024 Tang Yun ping <typ@rock-chips.com> rk3566: ddr: update ddrbin to v1.22
build from:
f8ac117e9c rk356x: ddr: fix eyescan build fail
build command:
./make.sh rk3568
update feature:
1. fix probabilistic read/write training failures under DDR4 2cs
introduced in ddrbin v1.21.
2. Fixed some DRAM compatibility issues at LP4x low frequency.
3. Undo vref training below 600MHz
4. The CLK/DQS slew rate supports different values at high and low frequencies.
5. Added DRAM Manufacturer ID printing.
6. DDR4 enable LPASR to reduce DDR4 self-refresh power.
Signed-off-by: Tang Yun ping <typ@rock-chips.com>
Change-Id: I0977c713416a3614ec1b22f40cfb7ba9dbaa188c
|