Documentation/networking/bonding.rst

28 multiple network interfaces into a single logical "bonded" interface.
50    3.1.2		Configuring Multiple Bonds with Sysconfig
53    3.2.2		Configuring Multiple Bonds with Initscripts
55    3.3.1		Configuring Multiple Bonds Manually
71    7.2	Configuring Multiple ARP Targets
85    11.2	High Availability in a Multiple Switch Topology
86    11.2.1		HA Bonding Mode Selection for Multiple Switch Topology
87    11.2.2		HA Link Monitoring for Multiple Switch Topology
93    12.2	Maximum Throughput in a Multiple Switch Topology
94    12.2.1		MT Bonding Mode Selection for Multiple Switch Topology
95    12.2.2		MT Link Monitoring for Multiple Switch Topology
310 	Specify these values in ddd.ddd.ddd.ddd format.  Multiple IP
376 	Validation is useful in network configurations in which multiple
380 	generated by the multiple bonding instances will fool the standard
430 	value should be a multiple of the miimon value; if not, it
431 	will be rounded down to the nearest multiple.  The default
491 		when multiple ports are programmed with the same MAC
744 	This delay should be a multiple of the link monitor interval
828 	should be a multiple of the miimon value; if not, it will be
829 	rounded down to the nearest multiple.  The default value is 0.
904 		traffic to a particular network peer to span multiple
906 		multiple slaves.
1053 Before editing, the file will contain multiple lines, and will look
1075 network configuration system will correctly start multiple instances
1121 system if you have multiple bonding devices.
1169 3.1.2 Configuring Multiple Bonds with Sysconfig
1173 handling multiple bonding devices.  All that is necessary is for each
1177 multiple bonding devices with identical parameters, create multiple
1258 is the proper syntax to specify multiple targets.  When specifying
1291 3.2.2 Configuring Multiple Bonds with Initscripts
1295 Enterprise Linux 5 support multiple bonding interfaces by simply
1299 not support this method for specifying multiple bonding interfaces; for
1300 those instances, see the "Configuring Multiple Bonds Manually" section,
1361 3.3.1 Configuring Multiple Bonds Manually
1364 This section contains information on configuring multiple
1366 initialization scripts lack support for configuring multiple bonds.
1368 If you require multiple bonding devices, but all with the same
1372 To create multiple bonding devices with differing options, it is
1377 provide multiple instances of bonding with differing options is to load
1378 the bonding driver multiple times.  Note that current versions of the
1384 To load multiple instances of the module, it is necessary to
1386 requires that every loaded module, even multiple instances of the same
1387 module, have a unique name).  This is accomplished by supplying multiple
1417 to configure multiple bonds with differing parameters (as they are older
1429 Use of the sysfs interface allows you to use multiple bonds
1431 It also allows you to use multiple, differently configured bonds when
1675 Any interface that needs a queue_id set should set it with multiple calls
1677 distributions that allow configuration via initscripts, multiple 'queue_id'
1936 7.2 Configuring Multiple ARP Targets
1946 Multiple ARP targets must be separated by commas as follows::
2184 connected via multiple physical links, then there is no availability
2194 11.2 High Availability in a Multiple Switch Topology
2197 With multiple switches, the configuration of bonding and the
2198 network changes dramatically.  In multiple switch topologies, there is
2217 switches (ISL, or inter switch link), and multiple ports connecting to
2221 11.2.1 HA Bonding Mode Selection for Multiple Switch Topology
2245 11.2.2 HA Link Monitoring Selection for Multiple Switch Topology
2256 In general, however, in a multiple switch topology, the ARP
2260 the ARP monitor should be configured with multiple targets (at least
2312 multiple physical links is, for purposes of configuring bonding, the
2358 	TCP/IP connection to stripe traffic across multiple
2457 	"local" network configuration, this mode balances multiple
2491 12.2 Maximum Throughput in a Multiple Switch Topology
2494 Multiple switches may be utilized to optimize for throughput
2517 performance, for example), using multiple smaller switches can be more
2526 12.2.1 MT Bonding Mode Selection for Multiple Switch Topology
2539 12.2.2 MT Link Monitoring for Multiple Switch Topology
2619 the interfaces attached to the bond may occupy multiple ports on a
2621 ports, the bond device receives multiple copies of the same packet
2689 multiple switch topology (one or more ESMs, zero or more PMs).  It is
2691 much like the example in "High Availability in a Multiple Switch